Phononic Thermal Kits: Solid State Cooling Solving the AI Thermal Bottleneck
Phononic Thermal Kits: Solid State Cooling Solving the AI Thermal Bottleneck
Proven Cooling for Transceivers and Co-Packaged Optics in AI Data Centers
Solid State Cooling: The Missing Link to Unlocking Full AI Performance
Ushering In a New Era of AI Data Center Performance
Phononic, the global leader in solid state cooling technology, is expanding its portfolio of advanced cooling solutions for networking, GPUs, and AI data centers.
Unleashing AI Performance: Why Cooling is Now as Critical as Compute
The Hot News Heard Around the Chillers: Optimizing Your AI Cooling Investments
Thermal Kit: Cooling to Unthrottle AI Performance
Introducing Phononic’s Thermal Kit: a precise, predictive, performance-enhancing cooling solution that unthrottles AI compute workloads and delivers attractive ROI.
Delivering Advanced Cooling Solutions for Pioneers like CERN Pushing the Limits of Science
Phononic's unparalleled design delivers cooling under tremendously challenging conditions
Accelerating the Future of AI
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
Responsive CDUs for AI Factory Energy Efficiency
Power densities of data centers are increasing at an alarming rate as AI is transforming business globally.
Improve performance; up to 60% gains in TDP with constant TCase versus industry standard.
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
Increase TDP While Maintaining Today’s Thermal Management Architecture
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
Innovative Approaches to Data Center Cooling for AI, Edge, and High-Performance Computing
Phononic’s own Chief Product Officer, Larry Yang, discusses the latest from Phononic Data Center Cooling solutions in his recent article on The Fast Mode.
Phononic’s CPO Talks Solid State Cooling on Global Podcast
Dinis and Larry explore building sustainable innovation through solid state technology as well as how Phononic is redefining what’s possible in cooling and beyond.
The Future of Data Center Cooling: Insights from NVIDIA GTC 2025
The 2025 NVIDIA GTC conference made one thing clear: the AI revolution is here — and it’s power-hungry.
Lightwave Exclusive: Interview with Phononic at OFC 2025
The Optical Fiber Communication Conference and Exhibition (OFC) 2025 in San Francisco provided a platform for showcasing the latest advancements in optical communications.
Experience the Future of Cooling at OFC 2025
AI is driving explosive growth in high-performance computing, accelerating the transition to 800G and 1.6T optical transceivers. But as data demands skyrocket, so do thermal challenges.
The Future Belongs to the Cooled
The explosive growth of AI, ML and cloud computing is driving
extraordinary demand for high-bandwidth optical transceivers.